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The ultra-thin optical isolator is developed in response to the needs of customers for short focal length products and market cost reduction. The thickness of the product with a metal ring is only 0.75mm, and the thickness of the bare chip product is only 0.5mm, and the bare chip product has no risk of degaussing reliability
Product Description
The ultra-thin optical isolator is developed in response to the needs of customers for short focal length products and market cost reduction. The thickness of the product with a metal ring is only 0.75mm, and the thickness of the bare chip product is only 0.5mm, and the bare chip product has no risk of degaussing reliability
Main features
Ultra-low insertion loss
Ultra high temperature stability
low cost design
smaller package size
Typical application
TOSA / BOSA / BIDI
Butterfly package laser
Product parameters
| parameter | unit | Specification | |
| Center wavelength (λc) | nm | 18 CWDM wavelengths | |
| bandwidth | nm | ±20 | |
| Isolation (@λc &25°C) | Min | dB | 30 |
| Isolation (@ full bandwidth, full temperature) | Min | dB | 25 |
| Insertion loss (full temperature range) | Max | dB | 0.3 |
| Core size | mm | 0.5, 0.6, 0.7, 0.8, customized | |
| withstand power | Max | mW | 300 |
| Centerpiece Placement Angle | Typical | ° | 7±1 |
| Operating temperature | ℃ | -40 to +85 | |
| storage temperature | ℃ | -40 to +85 | |
| size | mm | Φ2.5X0.75mm, (with metal ring, maximum CA1.3mm)Φ1.8X0.75mm, (with metal ring, maximum CA0.85mm)Φ1.25X0.75mm, (with metal ring, CA0.5mm)Thickness<0.5mm (bare chip) | |
| Incident polarization direction error | ° | ±10 | |
| RoHS | RoHS Compliant | ||
